How does aqueous cleaning fluid effectively remove tiny contaminants from semiconductor packaging devices?
Publish Time: 2025-06-04
In the field of modern electronic manufacturing, especially in the production process of power modules and power electronic equipment, the cleaning process is crucial. With the improvement of chip integration and the complexity of packaging processes, the presence of tiny contaminants may directly affect the electrical performance, reliability and long-term stability of the product. Therefore, aqueous cleaning fluid, such as SJ-09A, plays an indispensable role in this process.1. Composition and mechanism of action of SJ-09Aaqueous cleaning fluidSJ-09A is a neutral aqueous cleaning agent designed for cleaning power modules and discrete devices. Its main ingredients include surfactants, corrosion inhibitors and deoxidation aids. These ingredients work synergistically to effectively remove flux residues generated during chip welding or heat sink welding, including rosin, water-soluble flux and no-clean flux.The cleaning fluid reduces the surface tension of the liquid and enhances its wetting ability on the metal surface, thereby penetrating into the complex structural gaps of the device. Subsequently, the surfactant molecules will wrap the pollutant particles and disperse them into the cleaning liquid to achieve a "decontamination" effect. At the same time, the corrosion inhibitor component can protect metal materials such as copper and aluminum from corrosion during the cleaning process, while the deoxidation aid can effectively remove the oxide layer on the copper surface and improve the adhesion of subsequent processes.2. Suitable for spray/ultrasonic cleaning equipment to improve cleaning efficiencySJ-09A has good compatibility and adaptability, and is particularly suitable for spray cleaning and ultrasonic cleaning equipment. These two cleaning methods can significantly improve cleaning efficiency and cleanliness:Spray cleaning: The cleaning liquid is evenly sprayed onto the surface of the device to be cleaned through a high-pressure nozzle, and the mechanical impact force is used to accelerate the detachment of pollutants. It is suitable for large-area and relatively simple-structured workpieces.Ultrasonic cleaning: High-frequency vibration is used to generate tiny bubbles. The energy released when the bubbles burst can penetrate into the gaps and blind holes of the device to remove pollutants in difficult-to-reach areas. It is especially suitable for power modules with complex structures and high precision requirements.The combination of these two can achieve all-round cleaning of power modules, lead frames, substrates and other components to ensure the ideal surface cleanliness.3. Excellent material compatibility to ensure device safetyWhen cleaning high-value semiconductor devices, the material compatibility of the cleaning agent is an important indicator that cannot be ignored. SJ-09A has a neutral pH value (close to 7), which avoids damage to sensitive components (such as chip protection layer, passivation film) caused by strong acids or strong alkalis. This makes it not cause corrosion, discoloration or functional degradation during the cleaning process, and is especially suitable for applications with high compatibility requirements for various metal materials such as copper, silver, nickel, and gold.In addition, SJ-09A also has excellent copper surface deoxidation ability. During the welding process, the copper substrate is easily oxidized by high temperature to form an oxide layer such as CuO or Cu₂O, which affects the subsequent thermal and electrical conductivity. The special additives in SJ-09A can reduce the oxide layer while cleaning, restore the metallic luster and electrical conductivity of the copper surface, and lay a good foundation for subsequent coating, bonding and other processes.4. Environmental protection and sustainable development advantagesAs an aqueous cleaning fluid, SJ-09A does not contain halogens, heavy metals, VOCs (volatile organic compounds) and other harmful substances, and meets the requirements of current global environmental regulations. Compared with traditional solvent-based cleaning agents, its use process is safer, non-toxic, and easy to treat wastewater, which helps companies build a green manufacturing system and promote the implementation of sustainable development strategies.Aqueous cleaning fluid SJ-09A plays an important role in the cleaning process of power modules and power electronic equipment with its efficient cleaning ability, wide material compatibility, excellent copper surface deoxidation performance and environmental friendliness. Whether it is used in spray or ultrasonic cleaning equipment, it can help manufacturers achieve ideal surface cleanliness and provide solid protection for subsequent packaging and testing processes.
