What types of cleaning equipment are suitable for aqueous cleaning fluid?
Publish Time: 2025-07-02
In the production process of semiconductor manufacturing and power electronic equipment, the cleaning process is a key link to ensure stable device performance, high reliability and long service life. During the chip welding or heat sink welding process of packaged products such as power modules and discrete devices, flux, grease and other contaminants often remain. If these impurities are not completely removed, they will directly affect the quality of subsequent lead binding, coating and molding processes. For this reason, the use of high-performance aqueous cleaning fluid has become an important means to achieve efficient and precise cleaning.Aqueous cleaning fluid is a conductor-grade aqueous cleaning fluid designed specifically for semiconductor packaging devices, with excellent cleaning ability and wide applicability. Aqueous cleaning fluid can effectively remove rosin-type, water-soluble and no-clean flux residues caused by welding on power modules and various electronic substrates. At the same time, it also has a good cleaning effect on metal surface oxides, especially with excellent copper surface deoxidation ability, which helps to restore the original state of the metal surface and improve the quality of welding and connection.One of its significant advantages is the neutral pH formula, which does not corrode or damage the chip and its protective layer during the cleaning process, greatly improving material compatibility. This feature is particularly important for semiconductor components that are sensitive to acid and alkali. It can effectively avoid device failure caused by improper cleaning and ensure product yield. In addition, aqueous cleaning fluid does not contain harmful substances such as halogen, phosphorus, and silicon, meets modern environmental protection requirements, and is suitable for green manufacturing processes.In practical applications, aqueous cleaning fluid shows strong adaptability and can be widely used in spray cleaning systems and ultrasonic cleaning equipment. Whether it is batch processing or continuous production line operation, it can achieve uniform and efficient cleaning effects. Its low foaming characteristics reduce foam interference during the cleaning process and improve cleaning efficiency. It is also convenient for rinsing and wastewater treatment, reducing the overall cost of use.It is worth mentioning that after cleaning with aqueous cleaning fluid, the surface of the device can reach extremely high cleanliness standards without any visible residue or film contamination, laying a solid foundation for subsequent key processes such as wire bonding, insulation coating, and plastic molding. This high cleanliness not only improves the electrical performance of the product, but also enhances the stability and long-term reliability of the overall structure. It is particularly suitable for application scenarios with extremely strict quality requirements in the fields of automotive electronics, industrial control, and new energy.Aqueous cleaning fluid has become an important solution in the field of semiconductor packaging device cleaning due to its excellent cleaning ability, excellent material compatibility, safe and environmentally friendly formula and good process adaptability. It not only meets the strict cleanliness requirements of high-precision electronic manufacturing, but also provides a strong guarantee for improving product yield and extending equipment life.
